FR-4 is the most widely used PCB material for standard electronics applications. Our assembly processes are optimized for single- and multilayer FR-4 boards, supporting consistent quality, stable thermal performance, and efficient high-volume production across industrial, medical, and commercial products.

We assemble flexible and rigid-flex PCBs designed for space-constrained and dynamic applications. Our capabilities support precise handling, controlled soldering processes, and reliable interconnections—enabling lightweight, compact designs with improved mechanical flexibility and durability.

For applications requiring effective thermal management, we support metal core PCBs, including aluminum-based designs. Our assembly processes are optimized to handle heat-dissipating structures, making them ideal for power electronics, LED lighting, and high-current applications.

We assemble high-frequency PCBs using specialized materials designed for RF and high-speed signal performance. Our controlled processes help maintain signal integrity, impedance consistency, and low loss—supporting RF, wireless, and high-speed communication applications.